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Aluminum and Copper Chemical Vapor Deposition on Fluoropolymer Dielectrics and Subsequent Interfacial Interactions

This study is an investigation of the chemical vapor deposition (CVD) of aluminum and copper on fluoropolymer surfaces and the subsequent interfacial interactions.

Identiferoai:union.ndltd.org:unt.edu/info:ark/67531/metadc279304
Date12 1900
CreatorsSutcliffe, Ronald David
ContributorsKelber, Jeffry Alan, 1952-, Braterman, Paul S., Jones, Paul R., Pinizzotto, Russell F., Chyan, Oliver Ming-Ren
PublisherUniversity of North Texas
Source SetsUniversity of North Texas
LanguageEnglish
Detected LanguageEnglish
TypeThesis or Dissertation
Formatix, 96 leaves : ill., Text
RightsPublic, Copyright, Copyright is held by the author, unless otherwise noted. All rights reserved., Sutcliffe, Ronald David

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