Thermoelectric (TE) devices can undergo degradation from reactions in corrosive environments and at higher operating temperatures by sublimation and oxidation. To prevent the degradation, we have applied two high temperature polymers (HTPs) as coatings for TE materials. Sintering temperatures were from 250°C to 400°C. We explain why dip coating is better technique in our study and had two potential HTPs for tests. By applying TGA (thermogravimetric analysis), we were able to figure out which HTPs have better thermal resistivity. Besides, TGA also help us to find proper curing cycles for HTPs. EDS and SEM results show that the coatings prevent oxidation and sublimation of TE materials. We also shorten HTP curing cycle time and lower the energy costs.
| Identifer | oai:union.ndltd.org:unt.edu/info:ark/67531/metadc1538763 |
| Date | 08 1900 |
| Creators | Chen, I Kang |
| Contributors | Du, Jincheng, Perez, Jose, Xia, Zhenhai, Young, Marcus, Brostow, Witold, 1934- |
| Publisher | University of North Texas |
| Source Sets | University of North Texas |
| Language | English |
| Detected Language | English |
| Type | Thesis or Dissertation |
| Format | viii, 50 pages, Text |
| Rights | Public, Chen, I Kang, Copyright, Copyright is held by the author, unless otherwise noted. All rights Reserved. |
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