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Job satisfaction of engineers in the electronics manufacturing field of Hong Kong: its situation and determinants.

by Wong Chi-Wing. / Thesis (M.B.A.)--Chinese University of Hong Kong, 1991. / Includes bibliographical references. / ABSTRACT --- p.ii / TABLE OF CONTENTS --- p.iv / LIST OF TABLES --- p.vi / ACKNOWLEDGEMENTS --- p.vii / Chapter / Chapter I. --- INTRODUCTION --- p.1 / Determinants of Job Satisfaction --- p.3 / Subject of Study --- p.7 / Pilot Interviews --- p.8 / Objectives of the Study --- p.11 / Hypotheses --- p.12 / Chapter II. --- METHODOLOGY --- p.13 / Population Frame and Sample Frame --- p.13 / Data Collection --- p.14 / Questionnaire Design --- p.14 / Data Analysis --- p.17 / Chapter III. --- RESULTS --- p.19 / Descriptive Statistics of Respondents --- p.19 / Reliability Analysis --- p.20 / Factor Analysis --- p.20 / Descriptive Statistics of Variables --- p.21 / Analysis of Variance --- p.22 / Correlation Among Variables --- p.23 / Multiple Regression Analysis --- p.24 / Chapter IV. --- DISCUSSION --- p.27 / General Situation of Engineers in Electronics Manufacturing Field --- p.27 / Correlation Among Overall Job Satisfaction and Other Variables --- p.29 / Factors Constituting Overall Job Satisfaction --- p.31 / Recommendations --- p.33 / Limitation of the Study --- p.35 / Suggestion for Further Research --- p.36 / Chapter V. --- SUMMARY --- p.37 / APPENDIX / Chapter I. --- Survey Questionnaire --- p.57 / Chapter II. --- Variables Investigated in the Study --- p.61 / Chapter III. --- SPSS/PC Command Programme --- p.52 / BIBLIOGRAPHY --- p.67

Identiferoai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_318694
Date January 1991
ContributorsWong, Chi-Wing., Chinese University of Hong Kong Graduate School. Division of Business Administration.
PublisherChinese University of Hong Kong
Source SetsThe Chinese University of Hong Kong
LanguageEnglish
Detected LanguageEnglish
TypeText, bibliography
Formatprint, vii, 69 leaves ; 30 cm.
CoverageChina, Hong Kong, China, Hong Kong, China, Hong Kong
RightsUse of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/)

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