Physical vapor deposition (PVD) refers to the removal of atoms from a solid or a liquid by
physical means, followed by deposition of those atoms on a nearby surface to form a thin film
or coating. Various approaches and techniques are applied to release the atoms including
thermal evaporation, electron beam evaporation, ion-driven sputtering, laser ablation, and
cathodic arc-based emission. Some of the approaches are based on a plasma discharge, while
in other cases the atoms composing the vapor are ionized either due to the release of the
film-forming species or they are ionized intentionally afterward. Here, a brief overview of the
various PVD techniques is given, while the emphasis is on sputtering, which is dominated by
magnetron sputtering, the most widely used technique for deposition of both metallic and
compound thin films. The advantages and drawbacks of the various techniques are discussed
and compared.
| Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:88398 |
| Date | 30 November 2023 |
| Creators | Gudmundsson, Jon Tomas, Anders, André, von Keudell, Achim |
| Publisher | IOP Publishing |
| Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
| Language | English |
| Detected Language | English |
| Type | info:eu-repo/semantics/publishedVersion, doc-type:article, info:eu-repo/semantics/article, doc-type:Text |
| Rights | info:eu-repo/semantics/openAccess |
| Relation | 10.1088/1361-6595/ac7f53 |
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