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Wire bond failure Mechanism and microstructure analysis

The Au-Al bond is a commonly used interconection in IC package.The different composition for Au wire will change the different IMC growth.
In this study, we will discuss the pure Au wire, and little Pd or Cu addition in Au wire reacted with Al pad for thermal aging, and we will give the models for these cases.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0701102-172940
Date01 July 2002
CreatorsJang, Herng-Shuoh
ContributorsBae-Heng Tseng, Tzer-Shin Sheu, Cho-Liang Chung, Der-shin Gan, New-Jin Ho, Ker-Chang Hsieh, Chih-Ching Huang
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0701102-172940
Rightsnot_available, Copyright information available at source archive

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