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System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques

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1. http://hdl.handle.net/1853/15833
2. 608215

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/15833
Date	05 1900
Creators	Liu, Sheng
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Dissertation
Rights	Access restricted to authorized Georgia Tech users only.