Two types of solder samples, pins and through-holes were tested by SERA™ (Sequential Electrochemical Reduction Analysis) and Wetting Balance after various length of steamaging treatment. It was shown that after steam-aging, both types of specimen gave a similar electrochemical reduction curve, and solderabilty predictions made from SERA™ test agree with results obtained from Wetting Balance test on a qualitative base. Wetting balance test of pin samples after SERA™ test confirmed that SERA™ is a non-destructive testing method -- it even restored solderability. Comparison of electrochemical reduction behavior of samples under different treatment indicates that steam-aging can not reproduce exactly the effect of naturally atmospheric aging, and may not be the best artificial accelerating environment adopted.
| Identifer | oai:union.ndltd.org:unt.edu/info:ark/67531/metadc501051 |
| Date | 05 1900 |
| Creators | Gao, Yang, 1966- |
| Contributors | Marshall, James L., 1940-, Acree, William E. (William Eugene) |
| Publisher | University of North Texas |
| Source Sets | University of North Texas |
| Language | English |
| Detected Language | English |
| Type | Thesis or Dissertation |
| Format | vi, 54 leaves: ill., Text |
| Rights | Public, Gao, Yang, 1966-, Copyright, Copyright is held by the author, unless otherwise noted. All rights reserved. |
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