Mechanisms which may play a role in superplastic deformation (grain strain mechanisms, grain boundary sliding (GBS) mechanisms) are reviewed. Two well-known lattice dislocation mechanisms are re-evaluated for grain boundary dislocations (GBDs). The manner in which the deformation mechanisms interact, or are inhibited or obscured, is discussed. Mechanisms of anelastic deformation are outlined, with particular reference to fine-grained materials. Expressions for anelastic recovery caused either by grain boundary (GB) tension or by the relaxation of GBD pile-ups are derived. The plastic properties of Sn-38.1w/o Pb and Sn-2w/o Pb are measured. They are similar in both alloys. No threshold stress for plastic deformation is detected, for stresses and strain rates as low as 0.IMPa and 10^-10s^-1 respectively. The presence of GB diffusion creep (Coble creep) is established experimentally in Sn-2w/o Pb with grain sizes ≥ 50μm. Coble creep is inhibited for small grain sizes (~10μm). The inhibition is explained by GBS caused by GBDs. In disagreement with the measurements, high threshold stresses are predicted for Sn-38.1w/o Pb. This implies that GBD line tensions are lower than those of lattice dislocations. The anelastic properties of Sn-2w/o Pb and Sn-38.1w/o Pb are determined from the elastic after-effect (anelastic recovery after unloading). They are remarkable: anelastic contractions larger than 0.2% and relaxation strengths (= ratio of anelastically recovered to elastically recovered strain) in excess of 100 are found. The anelastic strains are approximately proportional to the stress and the inverse grain size. A wide range of relaxation times (~ 6 decades) is observed. A mechanism based on the relaxation of GBD pile-ups is in qualitative agreement with the measured anelasticity. The high measured relaxation strengths, however, imply that the interaction between GBDs is much weaker (~ 2 orders of magnitude) than that between lattice dislocations. This could be due to a relatively low self-energy of GBDs and would be in qualitative agreement with the low GBD line tensions suggested above. The influence of anelasticity on transients (e.g. stress relaxation, dip test) is investigated using a rheological model with three Voigt elements (anelasticity) and a nonlinear dashpot (plasticity). Using independently determined plastic and anelastic parameters the 4-th order differential equa tion corresponding to the model is solved numerically for several examples. Measured transients are much more accurately predicted with the present model than with models neglecting anelasticity.

The purpose of this thesis has been the determination of the nature and cause of time-softening property of the lead-tin alloys in the solid solution range. An alloy of 19% tin, 81% lead was chosen as exhibiting the property to a degree suitable for observation of the accompanying phenomena. The investigation proceeded in three parts: (1) an observation of the time-softening property itself by means of series of hardness tests to determine the degree of change and the time required for its accomplishment; (2) a search for x-ray evidence of possible precipitation which might be apparent as a change in the lattice constant of the crystal; and (3) conductivity measurements as a further check on whether the solution concentration was changing. The results accordingly may be classified under the same three headings. The change in hardness of the lead-tin alloy under investigation is intimately related to its habit of precipitating some of the excess tin from the solid solution. Both the x-ray and the conductivity test results offer supporting evidence that precipitation does occur in conjunction with the softening effect. Apparently also the softening effect observed in the lead-tin alloy is a definite phenomenon distinct from the “over-aging” effect in which an alloy aged at high temperature increases rapidly in hardness until a certain critical hardness is reached, after which softening sets in. / M.S.

Two types of solder samples, pins and through-holes were tested by SERA™ (Sequential Electrochemical Reduction Analysis) and Wetting Balance after various length of steamaging treatment. It was shown that after steam-aging, both types of specimen gave a similar electrochemical reduction curve, and solderabilty predictions made from SERA™ test agree with results obtained from Wetting Balance test on a qualitative base. Wetting balance test of pin samples after SERA™ test confirmed that SERA™ is a non-destructive testing method -- it even restored solderability. Comparison of electrochemical reduction behavior of samples under different treatment indicates that steam-aging can not reproduce exactly the effect of naturally atmospheric aging, and may not be the best artificial accelerating environment adopted.

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