Return to search

In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests

No description available.

1. http://hdl.handle.net/1853/5442

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/5442
Date	01 December 2003
Creators	Zhang, Jian
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Language	en_US
Detected Language	English
Type	Dissertation
Format	12060879 bytes, application/pdf