Return to search

Study on no-flow underfill materials for low-cost flip-chip applications

No description available.
Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/18968
Date05 1900
CreatorsShi, Songhua
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Detected LanguageEnglish
TypeDissertation
RightsAccess restricted to authorized Georgia Tech users only.

Page generated in 0.0016 seconds