<p>Packaging of high density integrated circuits offers many
challenges in the electronics industry today. Advanced requirements
for high performance computing are starting to take advantage of
multichip modules that are smaller in size and weight, use less energy,
and cost less than prior technologies. This project and report provides
a summary of the processes of multichip module packaging and
describes some of the companies and their technologies currently
involved in the industry today. An advanced computer system is
proposed that would require a high density multichlp module. Functional
requirements and performance specifications are identified for the
system.</p>
<p>
Many design decisions are required to determine the best
integrated circuit package for the system, with trade-off analysis being
key in the selection process. One comparative analysis worthy of study
is the evaluation of high density interconnection alternatives.
Two technologies of multichip module designs are compared using
the Analytic Hierarchy Process. Main attributes of the alternatives are
chosen that are key to thp design and have significant differences. The
attributes are defined in detail and weighted based on their importance
to the model. Performance data is also used in the comparisons of
alternatives.</p>
<p>
A spreadsheet program was developed to quickly enter the
weighted values and performance data, perform the matrix calculations,
and determine the final rankings of the alternatives. Sensitivity analysis
was then applied to determine what effect a change in the value of a
particular attribute had on the outcome of the rankings. Results of the
sensitivity analysis for key attributes are graphically plotted.</p> / Master of Science
| Identifer | oai:union.ndltd.org:VTETD/oai:vtechworks.lib.vt.edu:10919/41645 |
| Date | 17 March 2010 |
| Creators | Grau, Peter F. |
| Contributors | Systems Engineering, Sullivan, William G., Fabrycky, Wolter J., Blanchard, Benjamin S. Jr. |
| Publisher | Virginia Tech |
| Source Sets | Virginia Tech Theses and Dissertation |
| Detected Language | English |
| Type | Master's project |
| Format | BTD, application/pdf |
| Relation | LD5655.V851_1993.G728.pdf |
Page generated in 0.002 seconds