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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
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Showing 1 to 10 of 49 (0.068 seconds)Spelling suggestions: "subject:"multichip modules (microelectronics)"" "subject:"multichip modules (icroelectronics)""
| 1 |
Automatic visual inspection of placement of bare dies in multichip modules /Chheda, Mahesh. January 1994 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1994. / Typescript. Includes bibliographical references (leaves 95-96).
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| 2 |
Design and fabrication of an underwater digital signal processor multichip module on low temperature cofired ceramic /Hayth-Perdue, Wendy, January 1994 (has links)
Thesis (M.S.)--Virginia Polytechnic Institute and State University, 1994. / Vita. Abstract. Includes bibliographical references (leaves 57-58). Also available via the Internet.
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| 3 |
New organic materials for microelectronics applicationsWright-Williams, Lorna M. 08 1900 (has links)
No description available.
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| 4 |
A fault detection and diagnosis technique for multi-chip module interconnectsKim, Bruce Chang-Shik 05 1900 (has links)
No description available.
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| 5 |
Design for testability techniques and optimization algorithms for performance and functional testing of mult-chip module interconnectionsPendurkar, Rajesh 05 1900 (has links)
No description available.
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| 6 |
Electrical characterization of a multilayer low temperature co-fireable ceramic multichip module /Barton, Cecil Edward, January 1994 (has links)
Thesis (M.S.)--Virginia Polytechnic Institute and State University, 1994. / Vita. Abstract. Includes bibliographical references (leaves 84-86). Also available via the Internet.
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| 7 |
Parallel test techniques for multi-chip modulesSasidhar, Koppolu 08 1900 (has links)
No description available.
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| 8 |
System-in-package a system level investigation for package reliability /Saiyed, Mohammed Shafi. January 2005 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Department of System Science and Industrial Engineering, 2005. / Includes bibliographical references.
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| 9 |
Design and simulation of a multichip module /Nazareth, Mathew B. January 1994 (has links)
Thesis (M.S.)--Rochester Institute of Technology, 1994. / Typescript. Includes bibliographical references (leaves 103-104).
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| 10 |
Toward a comprehensive cost model for multichip module (MCM) manufacturingPierce, Daniel W. 12 1900 (has links)
No description available.
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