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Wetting of grain boundaries in ultrafine-grained copper by liquid bismuth

In the present work, we studied the effect of liquid Bi on the microstructure evolution of ultrafinegrained Cu at elevated temperatures.

Identiferoai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:31737
Date19 September 2018
CreatorsKosinova, A., Straumal, B., Rabkin, E.
Source SetsHochschulschriftenserver (HSSS) der SLUB Dresden
LanguageEnglish
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/acceptedVersion, doc-type:article, info:eu-repo/semantics/article, doc-type:Text
Rightsinfo:eu-repo/semantics/openAccess
Relation41, urn:nbn:de:bsz:15-qucosa2-315695, qucosa:31569

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