Abstract
The effects of residual stresses distribution and post-weld-shift on the signal coupling efficiency of an Optical Add & Drop Multiplex (OADM) are investigated in this thesis. The position variations between the two collimators in the OADM under the temperature cycling test and high temperature aging test have been simulated and studied.
The finite element method package, i.e. MARC, is used for the stresses and deformation simulations of an OADM under different load cases. The coupled thermal-elastic-plastic model is employed in the analysis, and the creep effect of the solder is considered in the numerical simulations. The temperature dependent material properties of the 63Sn/37Pb and 96.5Sn/3.5Ag solder are used for the solder solidification, temperature cycling and aging tests. The effects of the OADM packaging parameters, i.e. the different offset angles between collimators, different solder are also studied. Besides, the same simulation and analysis has also applied on the soldering with and without cavity. A comparison between the simulated and measured results indicates that the proposed finite element model is feasible for analyzing the OADM packaging problems.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0723102-154443 |
| Date | 23 July 2002 |
| Creators | Chen, Chin-Ming |
| Contributors | Ying-Chien Tsai, none, Der-Min Tsay, Jao-Hwa Kuang, Wood-Hi Cheng |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0723102-154443 |
| Rights | campus_withheld, Copyright information available at source archive |
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