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Synthesis and characterization of sol-gel derived PI/silica hybrid material for low dielectric constant application

Sol-gel process was utilized to produce organic/inorganic composite in this research, and the effect of mixing time¡]of polymer¡¦s and silica¡¦s precursor¡^ and coupling agent were investigated. To get low к materials was also the important objective. TMA, TGA, SEM, FT-IR, and RF impedance were used to investigate thermal properties, chemical bonding, morphology, and dielectric constant, respectively.
The experiments showed that mixing time influence little to thermal stability but a lot to morphology and к. When mixing time was nearer to reaction time, the particle of silica was larger and the surface was flatter. The materials with coupling agent didn¡¦t show the same tendency as one without coupling agent. Regardless of coupling agent, it got larger к when mixing time was nearer to reaction time. Comparing with pure polymer, the modified materials got lower к. The lowest к got in this research was 2.36 which was lower than other materials.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0724104-165145
Date24 July 2004
CreatorsHu, Yu-cheng
ContributorsTzu-chien Hsu, Hong-yang Lu, Bing-hwait Hwang
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0724104-165145
Rightsoff_campus_withheld, Copyright information available at source archive

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