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On-wafer characterization of ground vias in multilayer FR-4 printed circuit boards at RF/microwave frequencies

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1. http://hdl.handle.net/1853/15806
2. 484927

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/15806
Date	12 1900
Creators	Cresci, David John
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis
Rights	Access restricted to authorized Georgia Tech users only.