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Finite element analysis of printed wiring board deformations during thermal cycles involved in the solder masking process

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1. http://hdl.handle.net/1853/15872
2. 356121

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/15872
Date	05 1900
Creators	Martin, Timothy Lee
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis
Rights	Access restricted to authorized Georgia Tech users only.