Return to search

Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)

No description available.

1. http://hdl.handle.net/1853/19641
2. 493963

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/19641
Date	05 1900
Creators	Li, Weiping
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Dissertation
Rights	Access restricted to authorized Georgia Tech users only.