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Microstructure Analysis of Sn-Ag-Cu Solder Ball in BGA Package

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Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0621105-103514
Date21 June 2005
CreatorsChang, Kuei-Min
ContributorsPouyan Shen, Ker-Chang Hsieh, Der-shin Gan
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0621105-103514
Rightsnot_available, Copyright information available at source archive

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