none

None.

The Study of Microstructure Analysis of Pb/Sn And Sn/Ag/Cu Solder Ball in BGA Package.

For the requirements of high-speed signal transmission has been increasing, the fiber array in the communication system has a lot of advantages which can not be replaced. But the loss of coupling efficiency is a difficult problem as the distance of communication is getting longer and longer. In order to increase the transmission and the coupling efficiency, we produce the two with high precision to reach the goal. The technique producing one dimension fiber array is very adept now. This paper chooses mounting several one dimension fiber array to produce the two dimension fiber array. Because BGA has self-alignment character, the fiber array can get nice mounting accuracy in horizontal but can¡¦t get in vertical. We use active packing to manufacture two dimension fiber. In this process we exert external force to control the mounting height. In the first, use approximate software to get the best manufacturing parameter. Then complete the experiment and compare the result with the approximation.

none

The influence of underfill material properties on the fatigue life of Ball Grid Array (BGA) packages that are subjected to thermal cycling is investigated in this study. A finite element model is created using Ansys by assuming the existence of an infinite array of solder interconnects, cylindrical in shape, surrounded by underfill material. Axial stresses in the interconnects are determined as a temperature loading is applied. The results show that these normal stresses are on the same order of magnitude as the hydrostatic compressive stresses induced in the solder upon underfill curing. Therefore it is concluded that for the range of underfill properties tested, these Mode I cyclic stresses need to be considered in the development of a fracture-based fatigue life model. In addition, a guideline is provided to aide researchers in designing experiments that will replicate loads on fractured specimens that are consistent with those seen in aerospace applications.

Experimental and numerical analyses were both adopted in the thesis. First, the BGA with three different solder ball components and pads, were investigated and their strength was affected by drop tests and thermal cycling test. Then the concept of numerical simulation to do the follow-up analysis was adopted. the relationships of stress, strain, and creep strain energy density were found. The lead-free solder ball has better resistance to the drop test with lower silver content; on the contrary, it has better properties due to thermal cycling tests with higher silver content. In the drop test, the failure of solder ball were found obviously in the packages that near four corner of the test board, and concentrated in the diagonal screw holes. The failure of solder ball was distributed over the peripheral of the package in the middle cross section of test board. Comparing the different position of 15 packages due to drop test, the amount of failed solder balls showed that the package positions U3, U8, U13 was obviously fractured, and the situation of fracture was relatively slight in the positions of U1, U5, U6, U7, U9, U10, U11, U15. In the fatigue life prediction of thermal cycling test, the simplified model of package in 45¢X direction was mostly close to the experimental data. After the except ion of the solder ball with failure mode A1, the major failure mode in drop test was mode B3. But the mode C was the majority of thermal cycling test. The structure and intensity of SMD play an important role on above experiments; the better choice of SMD can reduce the rate of failure mode A1, and improve the accuracy of the experiment.

none

A complete methodology has been proposed to model and evaluate IC packages in the high-speed digital and radio-frequency applications. The package types that are studied in this dissertation include BGAs, TSSOPs and BCCs. In characterization of BGAs, both frequency-domain and time-domain techniques have been applied and compared to each other. It was found that the best strategy was to find a rough coupled transmission-line model in the time domain and refine it through the optimization scheme in the frequency domain. Equivalent lumped model has been further derived from the coupled transmission-line model using the concept of distributed parameters. For RFIC applications, the electrical model of BCC, one type of lead-frame CSP, has been established based on the frequency-domain technique. To evaluate the package performance, an on-chip 50-ohm microstrip line housed in the package has been investigated. The insertion and return losses were analyzed and measured. Excellent agreement has been observed up to Ku band. The package acts as a low-pass filter to cause a cut off for the line above a certain frequency, which was predicted successfully from the established package model. The simulation results also show that BCC exhibits higher cut-off frequency and lower insertion loss in the passband when compared to TSSOP, one of the currently most popular RFIC packages.

none