A complete methodology has been proposed to model and evaluate IC packages in the high-speed digital and radio-frequency applications. The package types that are studied in this dissertation include BGAs, TSSOPs and BCCs. In characterization of BGAs, both frequency-domain and time-domain techniques have been applied and compared to each other. It was found that the best strategy was to find a rough coupled transmission-line model in the time domain and refine it through the optimization scheme in the frequency domain. Equivalent lumped model has been further derived from the coupled transmission-line model using the concept of distributed parameters.
For RFIC applications, the electrical model of BCC, one type of lead-frame CSP, has been established based on the frequency-domain technique. To evaluate the package performance, an on-chip 50-ohm microstrip line housed in the package has been investigated. The insertion and return losses were analyzed and measured. Excellent agreement has been observed up to Ku band. The package acts as a low-pass filter to cause a cut off for the line above a certain frequency, which was predicted successfully from the established package model. The simulation results also show that BCC exhibits higher cut-off frequency and lower insertion loss in the passband when compared to TSSOP, one of the currently most popular RFIC packages.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0618101-170838 |
| Date | 18 June 2001 |
| Creators | Wu, Sung-Mao |
| Contributors | Tzyy-Sheng Horng, Sheng-Fuh Chang, Huey-Ru Chuang, Chih-Wen Kuo, Lin-Lu Wong, T-L Lin, Sheng-Lung Huang, Ken-Huang Lin |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0618101-170838 |
| Rights | unrestricted, Copyright information available at source archive |
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