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Porovnání pájecích past z pohledu spolehlivosti pájeného spoje / Solder Paste Comparison from Solder Joint Reliability Point of View

This thesis deals with the teoretical description of the solder during reflow soldering the solder paste and describing the defects arising during this process. Practical part of the thesis describes the testing of two solder pastes with different silver content before and after the accelerated temperature cycle.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:376992
Date January 2018
CreatorsDokoupil, Jakub
ContributorsPetr, Martinec, Starý, Jiří
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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