Mycronic is a company that manufactures a solder paste printer used to manufacturecircuit boards. Inside the printer solder paste is fed with the help of a screw pump.The solder paste, consisting of relatively soft metals has a tendency to stick to thescrew surface and form particles. These are then detached and passed on in thesystem and can clog the nozzle of the printer. This project investigated the possibilityof creating a model test where different parameters can be varied to evaluate itsinfluence on the amount of solder paste sticking to the surface of the screw. Testingthese parameters directly in the solder paste printer would be time consuming andexpensive.A pin-on-disk set up with some modified parts was used to emulate the solder pastemotion in the screw pump. The results were then analyzed in light optical microscope(LOM) and scanning electron microscope (SEM) equipped with energy dispersivex-ray spectroscopy (EDS).The parameters that were varied were pressure, temperature, rotation speed,substrate, content of the paste and the shape of the profile, which is supposed toemulate the ridge of the screw. It was shown that the profile shape, the substrate andthe pressure was of great importance in the deformation of the solder balls while therotation speed and the paste content had a small or no effect.The goal of the project is to recreate the agglomerates that have led to malfunctionsin the printing and evaluate which parameters that have the greatest significance.

The purpose of this project has been to investigate potential correlations between rheological properties and jetting quality of solder paste. The project was carried out for Mycronic AB. Data from previously obtained measurements for both rheological properties and jetting quality were used in the analysis. We were only able to suggest preliminary correlations. One reason for this was that the jetting data was not designed for correlation work. It was performed to set parameters for new fluids. The data was inconsistent and difficult to work with in a correlation studie. However, the work led to a framework for future studies and correlation work.

The jet printing of solder paste from a uid dynamics perspective involves viscosity change due to varying shear rate and eventual break o of the ejected solder paste droplet from the uid in the printer head. The ability to model the jetting process in a simulation package is important as it can be used as a tool for future development of the jetting device. The jetting process is modelled as a two phase (air - solder paste) ow with interface tracking performed using phase eld method and temporal stepping based on a second-order Backward Di erence Formula with relaxed tolerences. This thesis investigates the droplet morphology, volume and speed predictions for three di erent piston actuation modes and solder paste viscosity denitions given by the Carreau- Yasuda model. A Darcy condition with the porosity parameter is calibrated equal to unity such that the droplet speed is within the realistic range of 20 m/s - 30 m/s. The simulations are compared against previous simulation results from IBOFlow, performed within a collaboration between Mycronic AB and Fraunhofer-Chalmers Centre. As the Carreau models cannot capture the dependence of the uid viscosity of ow history, an indirect structure based viscosity model is used to compare the thixotopic behaviour. The expressions for the parameters of the structure based viscosity model are derived based on an analytical model which assumes that shear rate is constant. Experimental data for constant shear rate is curve tted on a Carreau model and an initial estimate of the parameters are obtained. The parameters are then adjusted to match experimental thixotopic behaviour. This method can be used to obtain parameter values for structure based viscosity models for uids with no previous data. Once the solder paste is ejected through the nozzle and the piston retracts, the uid undergoes stretching. Studying lament stretching during jetting is dicult as it can be driven by both droplet and piston motion. The data from an extensional rheometer is analyzed to study the lament stretching phenomenon for solder pastes. An analytical model for the critical aspect ratio is derived for a Newtonian uid lament undergoing a pure extension and modelled as a cylinder whose radius is decreases with time. The exponential decrease of the lament radius predicted by the analytical model is found to reproduce the experimental observations very well. The lament radius calculated based on the lament height from the experiments and analytical model shows that the model captures the stretching process, but the formation of beads usually seen in suspensions is not accounted for.

The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufacturability and minimization of uncontrolled rework must therefore enhance inservice sustainability for 'power-by-the-hour' commercial aircraft operation business models.

As the world moves towards eliminating lead from consumer products, the microelectronics industry has put effort into developing lead-free solder paste. The major drawback of lead-free solder is the problems caused by its high reflow temperature. Variable frequency microwave (VFM) processing has been shown to allow some materials to be processed at lower temperatures. Issues addressed in this study include using VFM to reduce the solder reflow temperature, comparing the heating rate of different size solder particles, and comparing the reliability of VFM reflowed solder versus conventionally reflowed solder. Results comparing the effect of particle size on the heating rate of solder showed that the differences were negligible. This is due in part to the particle sizes overlapping. Many lead-free solder pastes reflow around 250℃. Results indicate that when using the VFM, lead-free solder paste will reflow at 220℃. The reliability of solder that was reflowed using the VFM at the reduced temperature was found to be comparable to solder reflowed in a conventional manner. Based on these findings, VFM processing can eliminate the major obstacles to making lead-free solder paste a more attractive option for use in the microelectronics industry.

The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex. The exploration of these factors, and how they may affect the reliability and quality of the joints can only be achieved through continuous research. In this project, essential areas of SMT joints were selected for study and analysis, with the intention of providing additional design and process guidelines for the production of quality SMT joints. In the infrared reflow process, one of the common defect phenomena is the occurrence of tombstoning; that is after soldering only one end of the component is soldered while the other is lifted up, assuming a position like a tombstone. The initiation of tombstoning during reflow was analysed based on the forces acting on the component. A model was developed to predict the initiation of this phenomenon. The model shows that, under vibration-free conditions, the surface tension of the molten solder is the source of the force causing the initiation of tombstoning. The contact angle, which varies with the length of the printed circuit board solder land, has a significant effect on the value of the surface tension acting as a force pulling upward on the component. The model further shows that tombstoning initiation is due to the combined effects of the surface tension; the weight of the component; the dimensions of the component; the length of the solder underneath the component; and the length of the solder protruding from the end of the component. Selected components were used as examples for predicting the conditions of initiation, and these conditions were further substantiated by a series of experiments. Another area of study was a method which directly pulled the components off printed circuit boards and this was used as a means for testing the bond quality of surface mount technology leadless chip solder joints. Components D7243, CC1206, RC1206, RC121O, and CC1 812 were selected for this study. It was found that the ultimate tensile force which breaks a component off the printed circuit board has the potential to be used as a parameter for measuring the quality of the solder joint. The effect of solder thickness on the strength of a joint has also been investigated. The shape of joints soldered by two methods, wave soldering and infrared reflow, were compared. Joints at the two ends of a component produced by infrared reflow were found more uniform than the ones produced by wave soldering. A recommendation is made here for the wave soldering approach in achieving uniform solder joints. The effects of solder shape on the joint strength were further investigated by finite element analysis. A convex joint was found marginally more robust than a concave joint. Two aspects of the internal structure of SMT solder joints were investigated, void content and copper/tin intermetallic compounds. The voiding conditions of wave-soldered and infrared reflow joints were compared. No voids were found in all specimens that were produced by wave soldering. However, there were always voids inside joints produced by infrared reflow. Microhardness tests indicated that the hardness of compounds at the copper/solder interface of infrared reflowed joints is lower than that in the wave-soldered joints. It is considered that the lower hardness of the interfacial region of the infrared reflowed joints is due to the presence of voids. Scanning electron microscopy was used to study the formation of copper/tin intermetallic compounds for joints produced by infrared reflow. The results show that Cu 6 Sn5 was the only compound with a detectable thickness. Other compounds such as Cu3 Sn, were virtually not found at all. Aging of the joints at 100°C, shows that both the Cu 6Sn5 and the overall interfacial thickness grew with time. One of the important areas which had been overlooked previously and was studied in some details was the effects of solder paste exposure on the quality of solder paste. The characteristic changes of solder paste due to exposure were investigated in three areas, weight loss, tackiness, and rheology. The evaporation of low boiling point solvents was considered as the main contribution to the loss in the weight of the solder paste. The weight loss against exposure time was found to follow an exponential behaviour. A method was designed to evaluate the tackiness changes of solder paste due to exposure. It was found that the decay of tackiness against exposure time can be expressed by a power law. It is recommended that solder paste manufacturers should provide the necessary characteristic constants so as to enable the characteristics to be calculated after a specific exposure. The rheological changes of the solder paste as a result of exposure were also investigated. The implication on the printability of the solder paste due to these changes was studied and discussed.

This thesis deals with the teoretical description of the solder during reflow soldering the solder paste and describing the defects arising during this process. Practical part of the thesis describes the testing of two solder pastes with different silver content before and after the accelerated temperature cycle.

This work is a research on the topic of reactive nanoparticles and their agitation into the solder paste, which it also describes. It describes in detail the properties of each solder alloys. It explains the creation of intermetallic layers in the soldering process and examines their structure. It also focuses on the evaluation and methodology of testing the properties of solder pastes. In the practical part, individual tests are performed with PF606 and PF610 solder paste.

Sabemos que em placas de circuito impresso montadas com tecnologia SMD Surface Mount Device podem ocorrer problemas com a migração eletroquímica. O fenômeno aparece principalmente porque os novos encapsulamentos possuem terminais com espaçamentos muito próximos. A migração eletroquímica pode tornar-se um potencial problema no processo de soldagem eletrônica quando é utilizado a tecnologia Lead Free na montagem das placas. O processo de migração eletroquímica ocorre quando temos metal, isolante e metal, em ambiente de alta umidade e sobre polarização elétrica, o metal deixa a posição inicial em forma de íon e se redeposita sobre o isolante. Em uma placa de circuito impresso, dois terminais adjacentes podem tornar-se eletrodos, dessa forma as dendritas crescem do cátodo para o ânodo. Podem aparecer diferentes morfologias com diferentes elementos envolvidos no processo de migração, dependendo da composição da pasta de solda ou acabamento da placa de circuito impresso. Uma estrutura do tipo pente comb feita sobre laminado FR4 foi utilizada nos experimentos. A distância entre as trilhas foram de 102 e 254 mícrons para simular uma distancia real dos terminais dos dispositivos. Os fatores considerados durante os experimentos foram: A distancia entre os terminais na estrutura (102 ou 254 mícrons), tensão aplicada (2 ou 3 V). Foi observado que a pasta de solda e o acabamento final não influenciam no processo de migração eletroquímica. O Estanho foi o principal metal que migrou. Todos os resultados obtidos nesse estudo concordam com a literatura. / It is well known that in printed circuits boards assembled by SMT technology may occur Electrochemical migration (ECM). This phenomenon appears mainly because the new packaging has the terminals very close. Also the Electrochemical migration may become a potential reliability problem in electronic soldering when lead free technology is used in soldering electronic devices. Electrochemical migration is an electrochemical process where metal on an insulating material, in a humid environment and under an applied electric field, leaves its initial location in ionic form and redeposit. In a PCB two adjacents terminal may behave as electrodes so the dendrites grow from cathode to anode. It can show different morphologies with the different migration elements involved depending on the solder paste composition or PCB surface finishing. A structure with a comb shape printed on FR4 substrate was used in the experiments. The distance between the fingers in the structure was 102 or 254 microns, in order to simulate a real distance between dispositive terminals. The factors considered during the experiments were surface finishing (ENIG or HASL), solder paste composition, distance between terminals (102 or 254 microns) and applied voltage (2 or 3 V). It was observed that the solder paste and the surface finishing dont influence the ECM process. Tin was the main metal that migrates. All the results obtained in these study agrees with the literature.

L’assemblage et le conditionnement en électronique représentent un enjeu de création de nouveaux systèmes électroniques hybrides rassemblant sur un même substrat des éléments électroniques, optiques, mécaniques… La technologie Flip-chip , introduite par IBM et baptisée C4 (Control Collapse Chip Connection), garantit une plus grande densité d’intégration tout en gardant les mêmes dimensions de puce. Au coeur de cette technologie, le « Bumping » est un procédé qui consiste en l’introduction d’une microbille conductrice entre deux plots de connexion des puces afin de réaliser une liaison électrique et mécanique avec le niveau de packaging suivant. La technique de dépôt par sérigraphie de pâte à braser est récemment devenue pratique en raison de son adaptation aux alliages sans plomb. Cette méthode présente l'avantage d'un faible coût et d'une possible production à grande échelle. Nous avons donc choisi de développer cette technique afin d’obtenir des matrices de connexions électriques de dimensions comprises entre 50 μm et 100 μm, pour une pâte à braser de type Sn3.0Ag0.5Cu. Nous avons déterminé les paramètres de sérigraphie afin d’obtenir un minimum d’étalement de pâte pour un remplissage maximum des ouvertures du masque choisi en Ni-électroformé d’épaisseur 50μm : une vitesse de racle de 20mm/s et une vitesse de démoulage de 4mm/s sont par exemple à retenir pour une pâte de type 5. L’étude du masque de sérigraphie a conduit au choix d’ouvertures circulaires. Des formes de billes circulaires ont été obtenues pour des UBM (Under Bump Metallurgy) également circulaires, de diamètre ¼ et ½ le diamètre de l’ouverture du masque. L’optimisation du profil de refusion a permis de déterminer qu’un palier à 180°C, un TAL de 90s ou plus et une température maximale à 250°C favorisaient l’obtention de billes circulaires avec absence de vides. Pour une pâte de type 6, des billes de 60à 70μm de diamètre ont été obtenues pour des ouvertures de masque de 100μm. Une étude de fiabilité de ces billes à partir de tests de cisaillement et de l’analyse des IMC (composés intermétalliques) formés après refusion a permis de montrer que des UBM en Cr-Cu-Au, de diamètre égal à la moitié de l’ouverture du masque, permettaient d’assurer un meilleur maintien mécanique des billes / The semiconductor industry has continuously improved its products by increasing the density of integration resulting in an increasing of the I/Os, always with a low cost requirement. To obtain high-density and high-speed packaging, the Flip-Chip interconnection technology was introduced by IBM also called C4 (Control Collapse Chip Connection). Solder bumps have been widely used in electronic industry and were generally based on the Sn-Pb alloy, for its low melting point and good wetting property. Containing highly toxic element (Pb), Pb-Sn solder alloy has been banned. The ternary alloy Sn-Ag-Cu seems to be the best compromise, in fact it as physical and chemical characteristics equivalent to that of Sn-Pb.In this study we are interested to optimize stencil printing process and adjust it with the flip-chip technology, in order to obtain solder bumps which height is between 50µm and 100µm associated to pitches less than or equal to 200µm, using Sn-3.0Ag-0.5Cu solder paste. We have optimized the stencil printing parameters machine, the stencil apertures shape and size (circular shape and 50µm height, for a Ni-electroformed stencil). Spherical solder balls have been achieved with circular UBM (Under Bump Metallurgy), which diameter is ¼ and ½ the diameter of the stencil aperture. The reflow thermal profile is the key to the formation of a reliable solder bump. It must allow a homogeneous reflow for all particles of the metallic solder paste. We define a thermal profile with a Time above liquidus (TAL) of 90s, a temperature in soaking zone (Ts) of 180°C and a maximum temperature (Tmax) of 250°C. For type 6 solder pastes, balls of 60-70µm diameter have been obtained for 100µm stencil apertures.The quality of a solder joint is directly related to the adhesion of the solder ball to the substrate. Among the various methods of mechanical testing, shear testing is the most widely used to assess the strength of the attachment of beads to the substrate and determine the fragility of the ball at the interface caused by the intermetallic layer compounds (IMC) formed after the reflow step. We have shown that Cr-Cu-Au UBM, with a diameter equal to the half of the stencil aperture, ensure the mechanical adhesion of the balls