Return to search

Fatigue Lifes of Sn/Pb and Sn/Ag/Cu Solder Balls

The Coffin-Manson equations of Sn/Ag/Cu and Sn/Pb solder joints are presented in this thesis. The experimental results of CSP thermal cycle fatigue test and ball shear test are used to formulate Coffin-Manson equations. The maximum amplitude of equivalent plastic shear strain corresponding to these two experiments are employed. The MARC finite element package is used to calculate the plastic shear strain. Different published fatigue experiment results have been used to show the accuracy and the feasibility of these proposed equations. The 3-D finite element models of the BGA type¡¦s CSP and VCSEL assembly are employed to simulate the thermal cycling fatigue. Results indicate that the fatigue lifes of solder predicted by using the proposed equations have good agreement with those measured from experimental tests.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0724104-002112
Date24 July 2004
CreatorsWu, Cheng-Hua
ContributorsDer-Min Tsay, Jao-Hwa Kuang, Yung-Chuan Chen, Chi-Hui Chien, Ying-Chien Tsai
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0724104-002112
Rightsnot_available, Copyright information available at source archive

Page generated in 0.0015 seconds