A Study on the Analysis of Competitive Strategy of Flip Chip Packaging Industry in Taiwan¡X Case Study on S Company
Abstract
The success of semiconductor industry in Taiwan significantly lies on the complete demarcation of the industry chain by companies involved in each area of IC design, foundry, packaging and testing. Nonetheless, packaging and testing are generally categorized to one industry as the major company usually runs packaging business in line with testing by emphasizing their turn-key solution. However, this concept will not be applied in the future even followed by the quantum breakthrough on the structure of the industry chain.
This is a qualitative descriptive study mainly on analysis of competitive advantage and strategy of Flip Chip Packaging Industry in Taiwan. The theme studied is hardly assessed by quantified data. However through the researcher¡¦s macro review of the industry environment as well as micro review of specific individual case with primary and secondary data all-around collected, the present situation, character and trend of the industry are understood by analyzing external environment and internal corporate, searching source of competitive advantage in line with a case study of competitive strategy.
The conclusion on future competitive strategy of Flip Chip Packaging Industry in Taiwan based on the case study is followed:
1. Under the trend of global demarcation with analysis, the future operation mode of Taiwan Flip Chip Packaging Industry should be transformed from low skill level to high technique intensive level through virtual integration of packaging and testing from the back end and IC design of the front end, which results in promoting the integration value of industry chain as well as providing the most efficient producing system to the globe.
2. Reviewing the current trend, development and competitors¡¦ competitive strategy of Taiwan Flip Chip Packaging Industry, analysis shows that under the evolution of technique and product, Taiwan Flip Chip Packaging Industry should take advantage of the special needs from IC design industry and IDM factories to devote to technique integration, application and development in the future. In addition the ability to innovate and establish standard will be uplifted with raising competitive from a complete industry chain and advanced foundry advantage.
3. Researching the core competitive from the case study and presenting the future competitive strategy of Taiwan Flip Chip Packaging Industry shows that differentiation directs the competition in line with stepping into production service and production research and development to replace cost advantage.
Key Word: Competitive Advantage, Competitive Strategy, Core Source ,
Flip Chip Package
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0129104-133737 |
| Date | 29 January 2004 |
| Creators | Cheng, Kun-chu |
| Contributors | HUANG¡APei-how, Chin-Tarn Lee, Feng -Lee LIN |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0129104-133737 |
| Rights | withheld, Copyright information available at source archive |
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