Transient Liquid Phase bonding under Temperature Gradient (TG-TLP bonding) is a relatively new process of TLP diffusion bonding family for joining difficult-to-weld aerospace materials. Earlier studies have suggested that in contrast to the conventional TLP bonding process, liquid state diffusion drives joint solidification in TG-TLP bonding process. In the present work, a mass conservative numerical model that considers asymmetry in joint solidification is developed using finite element method to properly study the TG-TLP bonding process. The numerical results, which are experimentally verified, show that unlike what has been previously reported, solid state diffusion plays a major role in controlling the solidification behavior during TG-TLP bonding process. The newly developed model provides a vital tool for further elucidation of the TG-TLP bonding process.
| Identifer | oai:union.ndltd.org:MANITOBA/oai:mspace.lib.umanitoba.ca:1993/21969 |
| Date | 30 July 2013 |
| Creators | Ghobadi Bigvand, Arian |
| Contributors | Ojo, Olanrewaju Akanbi (Mechanical and Manufacturing Engineering), ElMekkawy, Tarek (Mechanical and Manufacturing Engineering) Rajapakse, Athula (Electrical and Computer Engineering) |
| Source Sets | University of Manitoba Canada |
| Detected Language | English |
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