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Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies

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1. http://urn.kb.se/resolve?urn=urn:nbn:se:bth-10918

Identifer	oai:union.ndltd.org:UPSALLA1/oai:DiVA.org:bth-10918
Date	January 2014
Creators	Mohammadi Panah, Mahshid
Publisher	Blekinge Tekniska Högskola, Institutionen för maskinteknik
Source Sets	DiVA Archive at Upsalla University
Language	English
Detected Language	English
Type	Student thesis, info:eu-repo/semantics/bachelorThesis, text
Format	application/pdf
Rights	info:eu-repo/semantics/openAccess