Bacterial infections caused by the formation of a biofilm on the implant aftersurgery is a severe problem affecting the implants long term function and often leading to implant failure. Copper is a natural trace element found in the human body, and has recently become a possible alloying element with strongantibacterial properties. In this master thesis, copper bearing titanium alloys with different concentrations of Cu (1, 3, 5 and 10 wt.% Cu) were prepared using two different heat treatments (T1 and T2) in order to kill the bacteria and prevent the formation of biofilms causing these infections. The antibacterial performance andCu ion release rate of the Ti-Cu alloys were investigated in order to determine their applicability as a biomaterial. The results from the experimental investigations showed that the addition of Cu provided the alloys with an antibacterial effect against Staphylococcus epidermidis. The alloys with 5 and 10 wt.% Cu had improved antibacterial properties, and the alloys with highest Cu content exhibited the strongest antibacterial ability with an antibacterial rate of 42% for the 10- Cu(T2) alloy and 48% for the 10-Cu(T1) alloy, after 6 hours. The Cu ion release rate of the Ti-Cu alloys with 1, 3 and 5 wt.% Cu were far below the daily recommended allowance according to WHO, while the alloys with 10 wt.% Cu showed Cu ion release rates substantially over the daily limit. For this reason, Ti- Cu alloys with less Cu content (>10 wt.%) are recommended. Nevertheless, Ti-Cu alloys have a promising future as a medical implant with antibacterial properties.
| Identifer | oai:union.ndltd.org:UPSALLA1/oai:DiVA.org:uu-393072 |
| Date | January 2019 |
| Creators | Eriksson, Andreas |
| Publisher | Uppsala universitet, Tillämpad materialvetenskap |
| Source Sets | DiVA Archive at Upsalla University |
| Language | English |
| Detected Language | English |
| Type | Student thesis, info:eu-repo/semantics/bachelorThesis, text |
| Format | application/pdf |
| Rights | info:eu-repo/semantics/openAccess |
| Relation | UPTEC Q, 1401-5773 ; 19005 |
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