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Integration of Ultrasonic Consolidation and Direct-Write to Fabricate an Embedded Electrical System Within a Metallic Enclosure

A research project was undertaken to integrate Ultrasonic Consolitation (UC) and Direct-Write (DW) technologies into a single apparatus to fabricate embedded electrical systems within an ultrasonically consolidated metallic enclosure. Process and design guidelines were developed after performing fundamental research on the operational capabilities of the implemented system. In order to develop such guidelines, numerous tests were performed on both UC and DW. The results from those tests, as well as the design and process guidelines for the fabrication of an embedded touch switch, can be used as a base for future research and experimentation on the UC-DW apparatus. The successful fabrication of an embedded touch switch proves the validity of the described design and process parameters and demonstrates the usefulness of this integration.

Identiferoai:union.ndltd.org:UTAHS/oai:digitalcommons.usu.edu:etd-1776
Date01 December 2010
CreatorsHernandez, Ludwing A.
PublisherDigitalCommons@USU
Source SetsUtah State University
Detected LanguageEnglish
Typetext
Formatapplication/pdf
SourceAll Graduate Theses and Dissertations
RightsCopyright for this work is held by the author. Transmission or reproduction of materials protected by copyright beyond that allowed by fair use requires the written permission of the copyright owners. Works not in the public domain cannot be commercially exploited without permission of the copyright owner. Responsibility for any use rests exclusively with the user. For more information contact Andrew Wesolek (andrew.wesolek@usu.edu).

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