The fabrication characteristic of focused ion beam (FIB) for Pyrex glass was investigated. FIB has several advantages such as high sensitivity, high material removal rates, low forward scattering, and direct fabrication in selective area without any etching mask, etc. In this study, FIB etched Pyrex glass was used for fast fabrication of 3-D submicron structures. A high-aspect-ratio (HRA) glass structure of 5 (1.97µm depth/0.39µm width) was fabricated. The experimental results in terms of limiting beam size, ion dose¡]ion/cm2¡^, beam current, etc was discussed. Xenon difluoride (XeF2) was applied to enhance the FIB process. Its influence on glass fabrication is studied and characterized.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0817106-164250 |
| Date | 17 August 2006 |
| Creators | Wu, Jhih-rong |
| Contributors | Cheng-tang Pan, Yuang-cherng Chiou, Chien-hsiang Chao |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0817106-164250 |
| Rights | campus_withheld, Copyright information available at source archive |
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