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IC packaging core competence constructed model- An instance of Advanced Semiconductor Engineering, INC.

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Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0726101-141148
Date26 July 2001
CreatorsLin, S-T
ContributorsCher-Min Fong, G. Gary Hu, Stephen D. Tsai
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0726101-141148
Rightsunrestricted, Copyright information available at source archive

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