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Solid State Diffusion Kinetics of Intermetallic Compound Formation in Composite Solder

The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and morphology of the two intermetallic phases (Cu6Sn5 and Cu3Sn) that form between a Cu substrate and Sn/Pb solder under different aging and annealing conditions.

Identiferoai:union.ndltd.org:unt.edu/info:ark/67531/metadc279330
Date05 1900
CreatorsSees, Jennifer A. (Jennifer Anne)
ContributorsMarshall, James L., 1940-, Acree, William E. (William Eugene), Theriot, L. J., Schwartz, Martin, Foster, Phillip R.
PublisherUniversity of North Texas
Source SetsUniversity of North Texas
LanguageEnglish
Detected LanguageEnglish
TypeThesis or Dissertation
Formatx, 157 leaves: ill., Text
RightsPublic, Copyright, Copyright is held by the author, unless otherwise noted. All rights reserved., Sees, Jennifer A. (Jennifer Anne)

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