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Mechanistic aspects of electroless copper plating on ceramic substrates for EMI shielding applications/

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1. https://stars.library.ucf.edu/rtd/1748

Identifer	oai:union.ndltd.org:ucf.edu/oai:stars.library.ucf.edu:rtd-2747
Date	01 October 2000
Creators	Akesson, Jorgen
Publisher	STARS
Source Sets	University of Central Florida
Language	English
Detected Language	English
Type	text
Source	Retrospective Theses and Dissertations