Conduction based compact thermal modeling of DC/DC converters, which are
electronic components commonly used in military applications, are investigated.
Three carefully designed numerical case studies are carried out at component, board
and system levels using ICEPAK software. Experiments are conducted to gather
temperature data that can be used to study compact thermal models (CTMs) with
different levels of simplification.
In the first (component level) problem a series of conduction based CTMs are
generated and used to study the thermal behavior of a Thin-Shrink Small Outline
Package (TSSOP) type DC/DC converter under free convection conditions. In the
second (board level) case study, CTM alternatives are produced and investigated for
module type DC/DC converter components using a printed circuit board (PCB) of an
electro-optic system. In the last case study, performance of the CTM alternatives
generated for the first case are assessed at the system level using them on a PCB
placed inside a realistic avionic box.
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Detailed comparison of accuracy of simulations obtained using CTMs with various
levels of simplification is made based on experimentally obtained temperature data.
Effects of grid size and quality, choice of turbulence modeling and space
discretization schemes on numerical solutions are discussed in detail.
It is seen that simulations provide results that are in agreement with measurements
when appropriate CTMs are used. It is also showed that remarkable reductions in
modeling and simulation times can be achieved by the use of CTMs, especially in
system level analysis.
| Identifer | oai:union.ndltd.org:METU/oai:etd.lib.metu.edu.tr:http://etd.lib.metu.edu.tr/upload/12612100/index.pdf |
| Date | 01 June 2010 |
| Creators | Ocak, Mustafa |
| Contributors | Sert, Cuneyt |
| Publisher | METU |
| Source Sets | Middle East Technical Univ. |
| Language | English |
| Detected Language | English |
| Type | M.S. Thesis |
| Format | text/pdf |
| Rights | To liberate the content for public access |
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