Abstract
The thesis is aimed to simulate the flip chip in chip scale package (FCCSP) by finite element method incorporated with software ANSYS due to thermally cyclic loading. The difference between two-dimensional and tree-dimensional structures is conferred. The position and height of solder bump in FCCSP and cyclic temperature are considered as parameters. The effects of above-mentioned parameters on package¡¦s fatigue models and fatigue damage are studied.
The results show that the two-dimensional structure can help us to understand the position of the maximum displacement and the maximum equivalent strain. However, the values of numerical result in the two- dimensional structure are not very accurate. The fatigue fracture will first take place at the top of the most outside solder bump far away from the center of the whole package. If the height of solder bump is lower, the fatigue fracture of solder bump is faster. If the duration time of high and low temperatures is longer, the fatigue fracture due to creep of solder bump becomes faster. When the height of solder bump is change, the change of fatigue damage with plastic strain of solder bump will more obvious than the change of fatigue damage due to creep of solder bump. The extension of duration time of high and low temperatures will increase fatigue damage due to creep of solder bump, but not change the fatigue damage with plastic strain of solder bump. When the height of solder bump is reduced or the duration time of high and low temperatures is extended will increase fatigue damage subjected to cyclic temperature.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0627102-185433 |
| Date | 27 June 2002 |
| Creators | Chen, Ping-Ju |
| Contributors | Shyue-Jian Wu, Chorng-Fun Liu, Ming-Hwa R. Jen |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0627102-185433 |
| Rights | off_campus_withheld, Copyright information available at source archive |
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