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Effect of Ground Bounce Noise on the Power Integrity and EMI Performance in Multi-Layered High-Speed Digital PCB: FDTD Modeling and Measurement

In this thesis, we study the electromagnetic effect of the high-speed digital PCB in three sections. In first section, based on the FDTD modeling approach, the bridging effect of the isolation moat on the EMI caused by the ground bounce noise is investigated. We find that isolating the noise source by slits is effective to eliminate the EMI, but bridges connecting between two sides of the slits will significantly degrade the effect of EMI protection. In second section, we investigate both in time and frequency domains the power plane noise coupling to signal trace with via transition in multi-layered PCB. Separating the power plane with slits is effective in reducing noise coupling in high frequency but a new resonant mode will be excited at lower frequency. Current distribution pattern of this new resonant mode between the power planes helps us to understand this phenomenon more clearly. In final section, by using FDTD link SPICE method, we can predict the electromagnetic behavior of the PCB with active device effectively.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0620102-192209
Date20 June 2002
CreatorsHwang, Jiunn-Nan
ContributorsTzyy-Sheng Horng, Tzong-Lin Wu, Chih-Wen Kuo, Huey-Ru Chuang
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0620102-192209
Rightsunrestricted, Copyright information available at source archive

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