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Characterization of lead-free solders for electronic packaging

Dissertation (Ph.D.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/226970398
Date January 2007
CreatorsMa, Hongtao, Johnson, R. Wayne, Suhling, J. C.
PublisherAuburn, Ala. ,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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