Return to search

Lead-free assembly and reliability of chip scale packages and 01005 components

Dissertation (Ph.D.)--Auburn University, / Abstract. Vita. Includes bibliographic references (p.139-147).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/427567743
Date January 2006
CreatorsLiu, Yueli, Johnson, R. Wayne,
PublisherAuburn, Ala. ,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

Page generated in 0.0017 seconds