In the past decade, there has been an increased interest in low-cost, low-power, high data rate wireless systems for both commercial and defense applications. Some of these include air defense systems, remote sensing radars, and communication systems that are used for unmanned aerial vehicles, ground vehicles, and even the individual consumer. All of these applications require state-of-the-art technologies to push the limits on several design factors such as functionality, weight, size, conformity, and performance while remaining cost effective. There are several potential solutions to accomplish these objectives and a highly pursued path is through the utilization of advanced integrated system platforms with high frequency, versatile, multilayered materials.
This work intends to explore advanced 3-D integration for state-of the art components in wireless systems using LCP multilayer organic platforms. Several packaging techniques are discussed that utilize the inherent benefits of this material. Wire bond, via interconnect, and flip-chip packages are implemented at RF and millimeter-wave (mm-wave) frequencies to explore the benefits of each in terms of convenience, reliability, cost, and performance. These techniques are then utilized for the demonstration of bulk acoustic waveguide (BAW) filter applications and for the realization of highly integrated phased-array antenna systems.
| Identifer | oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/44800 |
| Date | 03 July 2012 |
| Creators | Patterson, Chad E. |
| Publisher | Georgia Institute of Technology |
| Source Sets | Georgia Tech Electronic Thesis and Dissertation Archive |
| Detected Language | English |
| Type | Dissertation |
Page generated in 0.0024 seconds