Interfacial adhesion and subcritical debonding of low-k dielectrics in flip-chip-packaged copper/low-k interconnect structures /

Description

Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 165-169). Available also in a digital version from Dissertation Abstracts.

Links & Downloads

1. http://www.lib.umi.com/cr/utexas/fullcit?p3143608

Tags

Dielectrics. Microelectronic packaging.

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/60423977
Date	January 2000
Creators	Miller, Mikel Rolf,
Source Sets	OCLC
Language	English
Detected Language	English