The Au-Al bond is a commonly used interconection in IC package.The different composition for Au wire will change the different IMC growth.
In this study, we will discuss the pure Au wire, and little Pd or Cu addition in Au wire reacted with Al pad for thermal aging, and we will give the models for these cases.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0701102-172940 |
| Date | 01 July 2002 |
| Creators | Jang, Herng-Shuoh |
| Contributors | Bae-Heng Tseng, Tzer-Shin Sheu, Cho-Liang Chung, Der-shin Gan, New-Jin Ho, Ker-Chang Hsieh, Chih-Ching Huang |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0701102-172940 |
| Rights | not_available, Copyright information available at source archive |
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