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Simultaneous solder reflow and underfill cure in next generation flip chip assembly

No description available.
Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/16681
Date08 1900
CreatorsFennell, Brett Jamerson
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Detected LanguageEnglish
TypeThesis
RightsAccess restricted to authorized Georgia Tech users only.

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