Spelling suggestions: "subject:"packaging ingesting"" "subject:"packaging andtesting""
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Simultaneous solder reflow and underfill cure in next generation flip chip assemblyFennell, Brett Jamerson 08 1900 (has links)
No description available.
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Thermo-mechanical evaluation of interfacial integrity in multilayered microelectronic packagesXie, Weidong 05 1900 (has links)
No description available.
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Virtual qualification methodology for next-generation area-array packagesRaghunathan, Rajiv 08 1900 (has links)
No description available.
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Establishment of an analytical and experimental test facility for the evaluation of thermal management in microelectric packagesCampbell, James Stephen, Jr. 05 1900 (has links)
No description available.
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Thermo-mechanical reliability of the VSPA package solder jointsMurphy, R. Sean 12 1900 (has links)
No description available.
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Design and integration of a large area warpage measurement systemPetriccione, Gregory James 05 1900 (has links)
No description available.
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In-process stress analysis of flip chip assemblies during underfill cure and environmental stress testingPalaniappan, Prema 08 1900 (has links)
No description available.
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Closure integrity testing of heat sealed aseptic packaging using scanning acoustic microscopyJarrosson, Bruno P. 21 July 2009 (has links)
The objective of this study was to determine the possible application of ultrasonic inspection for non-destructive, online evaluation of the integrity of heat sealed, flexible package structure commonly used in packaging of aseptic and shelf-stable food products.
A scanning acoustic microscope (SAM), Olympus UH-3, and image analysis system were used to establish the operational parameters to ultrasonically inspect the heat seal closure of various flexible packages. The frequency range, attenuation, and focal length (Z-value) were determined respectively for paper laminate containers, plastic and plastic/aluminum pouches and plastic trays with plastic or plastic/aluminum lidding materials.
The SAM images of channel leakers, blisters and wrinkles were sufficiently characteristic to allow their identification. The same should be possible in an on-line, ultrasonic testing device through proper design of the transducers and scanning mechanism of the inspection system and by monitoring of the ultrasonic signal. Channel leakers of 20 μm diameter were successfully detected in all package structures with the exception of the paper laminate which scattered the ultrasonic waves. The frequency used for inspection ranged from 30 to 100 MHz and best results were obtained when focussing at the seal bottom surface. As a general rule, lower frequencies were used for inspection of relatively thick seals or laminates containing an aluminum layer. Geometry, thickness, surface characteristics, and laminate composition of the seal to be inspected were found to affect SAM's performance. The SAM was able to detect defects as small as 20 μm when working in the pulse mode, using focussed transducers of frequency ranging between 30 and 100 MHz. However, because smaller defects could not technically be manufactured at the seal interface, this value is not definite and it is believed that smaller defects could be successfully detected, especially in the higher frequency range. For optimum results, seals to be inspected should be free of embossment, flat, and should remain parallel to the surface of the transducer during inspection. Finally, biotests showed that a 20 μm channel leaker in a seal of 5 mm width was of sufficient size to cause post-process contamination in Meal Ready to Eat (MRE, plastics/AI structure) pouches. / Master of Science
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APTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGINGShiang, Jyue-Jon, 1956- January 1987 (has links)
ANSYS Packaging Thermal/Mechanical Calculator (APTMC) is an interface program developed for use with ANSYS and specially designed to handle thermal and thermally induced stress modeling/simulation of Level 1 and Level 2 VLSI packaging structures and assemblies. APTMC is written in PASCAL and operates in an interactive I/O format mode. This user-friendly tool leads an analyst/designer through the process of creating appropriate thermal and thermally induced stress models and other operations necessary to run ANSYS. It includes such steps as the following: (1) construction of ANSYS commands through the string process; (2) creation of a dynamic data structure which expands and contracts during program execution based on the data storage requirements of the program sets to control model generation; (3) access of material data and model parameters from the developed INTERNAL DATABANK which contains: (a) material data list; (b) heat transfer modes; and (c) library of structures; (4) forming ANSYS PREP7 and POSTn command files. (Abstract shortened with permission of author.)
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Analysis of the solder paste release in fine pitch stencil printing processesRodriguez, German Dario 08 1900 (has links)
No description available.
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