<p>The high luminosity phase of the LHC, poised to start taking
data in 2027, aims to increase the instantaneous luminosity of the machine to 7.5
x 10<sup>34</sup> cm<sup>-2</sup> s<sup>-1</sup>. This will make it possible
for experiments at CERN to make higher precision measurements on known physics
phenomenon as well as to search for “new physics”. However, this motivates the
need for hardware upgrades at the various experiments in order to ensure
compatibility with the HL-LHC. This thesis describes some of the efforts to
upgrade the inner-most layers of the Compact Muon Solenoid, namely the CMS
silicon pixel tracking detector. </p>
<p>Silicon sensors used to track particles are installed in the
detector as part of a pixel sensor module. Modules consist of a silicon
sensor-readout chip assembly that is wire-bonded to an HDI, or High Density
Interconnects to provide power and signals. </p>
<p>As part of the upgrade, 2,541 modules need to be assembled
delicately and identically with alignment error margins as low as 10 microns.
Assembly will be across three production sites in clean rooms to avoid dust and
humidity contamination.</p>
<p>In addition, the modules need to survive high magnetic
fields and extended close-range radiation as part of the HL-LHC.</p>
<p>In line with this effort, new materials and assembly
procedures able to sustain such damage are investigated. Techniques to assemble
modules are explored, specifically precision placing of parts with a robotic
gantry and techniques to protect wirebonds. This is followed by a discussion of
the accuracy and repeatability.</p>
| Identifer | oai:union.ndltd.org:purdue.edu/oai:figshare.com:article/12968045 |
| Date | 16 December 2020 |
| Creators | Simran Sunil Gurdasani (9385172) |
| Source Sets | Purdue University |
| Detected Language | English |
| Type | Text, Thesis |
| Rights | CC BY 4.0 |
| Relation | https://figshare.com/articles/thesis/Pixel_Sensor_Module_Assembly_Procedures_for_The_CMS_High_Luminosity_LHC_Upgrade/12968045 |
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