The variations of residual stress distributions on solder balls under the cyclic thermal load and aging processes are investigated in this thesis. The solidification phenomena for different shapes and materials of the solder balls during the reflow process are predicted by using the Surface Evolver program. The distribution of residual stress in the solder ball is calculated by employing the MARC finite element package. The temperature dependent material properties of the solders, i.e. 63Sn/37Pb and 96.5Sn/3.5Ag, are used in the residual stresses calculations. The variation of the residual stresses distributions of different solder balls under the temperature cycling test ( between ¡V40¢J and 85¢J ) and the aging test ( at 85¢J ) are simulated and studied. The effects of the solder parameters, i.e. the solder height and the pad geometry shapes on the residual stresses distribution are also studied. Besides, the same simulation and analysis has also applied on the solder ball with an unleaded solder 96.5Sn/3.5Ag. A better understanding about the variation of the residual stress in a solder ball is expected from this analysis.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0725101-152443 |
| Date | 25 July 2001 |
| Creators | Hsiao, Sheng-Chung |
| Contributors | Jao-Hwa Kuang, Li-Sen Chen, Wood-Hi Cheng |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0725101-152443 |
| Rights | campus_withheld, Copyright information available at source archive |
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