1.Sn/Ag4.0/Cu0.5 solder with better performance by the improved reflow profile.
2.The Sn/Ag2.6/Cu0.6¡BSn/Ag4.0/Cu0.5 with similar reliability test performance.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0212104-204052 |
| Date | 12 February 2004 |
| Creators | Liu, Chin-chiang |
| Contributors | Cheng-Yi Chen, Chi-Cheng Cheng, Chau-Chang Wang |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0212104-204052 |
| Rights | unrestricted, Copyright information available at source archive |
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