Approved for public release; distribution is unlimited / Solder joints provide both electrical and mechanical interconnections between a silicon chip and the packaging substrate in an electronic application. The thermomechanical cycling (TMC) in the solder due to the mismatch of the coefficient of thermal expansion (CTE) between the silicon chip and the substrate causes numerous reliability challenges. This situation is aggravated by the ongoing transition to lead-free solders worldwide, and the trend towards larger, hotter-running chips. Therefore, improved solder joints, with higher resistance to creep and low-cycle fatigue, are necessary for future generations of microelectronics. This study reports in the development a process to fabricate solder joints with a fine distribution of shape memory alloys (SMA) NiTi particulates. The microstructure and interface zone of the as-reflowed solder-SMA composite has been characterized. / Lieutenant, United States Navy
| Identifer | oai:union.ndltd.org:nps.edu/oai:calhoun.nps.edu:10945/1681 |
| Date | 03 1900 |
| Creators | Wright, William L. |
| Contributors | Dutta, Indranath, Naval Postgraduate School (U.S.)., Mechanical and Astronautical Engineering |
| Publisher | Monterey, California. Naval Postgraduate School |
| Source Sets | Naval Postgraduate School |
| Detected Language | English |
| Type | Thesis |
| Format | xiv, 49 p. : ill. (some col.) ;, application/pdf |
| Rights | This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States. |
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