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The Laser Diode Module Packaging by Soldering Technique

ABSTRACT
A DIP (dual-in-line) laser diode module packaging by soldering technique was investigated. We made high coupling efficiency fiber lens under the best arc fusing conditions. The coupling efficiency of fiber lens was obtained 82%, while offset of fiber lens center was less than 0.5mm and curvature radius was about 9mm. We metallized the high coupling efficiency fiber lens, and packaged it in the DIP housing. The components inside the module were uncoated FP (Fabry-Perot) laser chip, p-i-n detector, substrate, and cooler. We made a package process as follows: 1) We utilized the heating apparatus to fix the FP laser, PIN detector, and thermistor on the substrate. 2) We utilized the heating apparatus to make the cooler fixed on the DIP housing and the substrate fixed on the cooler. 3) We utilized the electrothermal heating machine to melt 1.5mm3 indium wire and adjusted the fiber lens by tweezer to couple light into the fiber inside the DIP housing. We obtained the 2.93mW output power and 58.6% coupling efficiency after packaging.
The post-soldering-shift resulted from the indium solidification was the most important factor affecting the coupling efficiency. By improving substrate design properly, we could reduce the indium quantity to minimize the solidification effect. The post-soldering-shift should be controlled below 1mm in the transverse axis and below 10 mm in the longitudinal axis, respectively. Finally, We achieved an external cavity fiber grating laser module with 2mW output power, and got an open eye pattern after measuring the DIP transmitter module.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0621102-125433
Date21 June 2002
CreatorsChang, Shin-En
ContributorsTsong-Sheng Lay, Wood-Hi Cheng, Sheng-Lung Huang, Ci-Ling Pan, Way-Seen Wang
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0621102-125433
Rightscampus_withheld, Copyright information available at source archive

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