This master thesis addresses the development of an automatic numerical tool for thermal analysis, focusing on thermal systems comprising a printed circuit board assembly and cooling case structure. The project, conducted in collaboration with Unibap, aims to enhance the design process of space computer modules by automating middle steps between design software and thermal analysis results. The numerical tool employs the lumped parameter method, implemented in Python, as an alternative to traditional finite element analysis to efficiently generate thermal results. Informed decisions can be made using the tool regarding case-cooling and the selection of components requiring cooling, thus optimizing manufacturing costs and design complexity. The project results in the successful development of the automatic numerical tool. A unique method to derive values for thermal resistance within the case structure is also utilized. Though experimental test results for verification are pending, the functionality of the tool is presented along with results from a thermal analysis where it is used.
| Identifer | oai:union.ndltd.org:UPSALLA1/oai:DiVA.org:uu-511701 |
| Date | January 2023 |
| Creators | Hamad, Baran |
| Publisher | Uppsala universitet, Elektricitetslära |
| Source Sets | DiVA Archive at Upsalla University |
| Language | English |
| Detected Language | English |
| Type | Student thesis, info:eu-repo/semantics/bachelorThesis, text |
| Format | application/pdf |
| Rights | info:eu-repo/semantics/openAccess |
| Relation | UPTEC F, 1401-5757 ; 23045 |
Page generated in 0.0019 seconds