IC packaging core competence constructed model- An instance of Advanced Semiconductor Engineering, INC.

Description

none

Links & Downloads

1. http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0726101-141148

Tags

core competence constructed model

core competence

IC packaging

Additional Fields

Identifer	oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0726101-141148
Date	26 July 2001
Creators	Lin, S-T
Contributors	Cher-Min Fong, G. Gary Hu, Stephen D. Tsai
Publisher	NSYSU
Source Sets	NSYSU Electronic Thesis and Dissertation Archive
Language	Cholon
Detected Language	English
Type	text
Format	application/pdf
Source	http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0726101-141148
Rights	unrestricted, Copyright information available at source archive